Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/31/1993
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Application #:
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07823914
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Filing Dt:
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01/22/1992
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Inventors:
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JOSEPH G. AMEEN, JOSEPH FUNARI, DAVID W. SISSENSTEIN
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Title:
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MULTILAYERED FLEXIBLE CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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LAWRENCE R. FRALEY |
IBM CORP. |
DEPT. N50, BLDG. 251-2 |
1701 N ST. |
ENDICOTT, NY 13760 |
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