Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/21/1993
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Application #:
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07748027
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Filing Dt:
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08/21/1991
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Inventor:
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KENNETH A. BELTZ
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Title:
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HEAT-RESISTANT HERMETIC PACKAGE FOR ELECTRONIC COMPONENTS AND METHOD OF MAKING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| INDUSTRIAL PARK |
| NEW BEDFORD, MASSACHUSETTS 02745 |
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| JOHN F. MCKENNA |
| 30 ROWES WHARF |
| BOSTON, MA 02110 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MORGAN HOUSE |
| MADEIRA WALK WINDSOR, BERKSHIRE U.K. SL4 1EP |
| BERKSHIRE, UNITED KINGDOM |
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| DEAN W. RUSSELL, ESQ. |
| KILPATRICK & CODY |
| STE. 2800 |
| 1100 PEACHTREE STREET |
| ATLANTA, GA 30309 |
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