Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/19/1993
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Application #:
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07756319
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Filing Dt:
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09/06/1991
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Inventor:
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KOU-CHUAN CHANG
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Title:
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BONDING PAD INTERCONNECTION ON A MULTIPLE CHIP MODULE HAVING MINIMUM CHANNEL WIDTH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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SEATTLE, KING COUNTY, WASHINGTON |
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CHRISTENSEN, O`CONNOR, JOHNSON AND |
KINDNESS |
2800 PACIFIC FIRST CENTRE |
1420 FIFTH AVENUE |
SEATTLE, WA 98101-2347 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2711 CENTERVILLE RD SUITE 400 |
WILMINGTON, DELAWARE 19808 |
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STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C |
1100 NEW YORK AVENUE, N.W. |
WASHINGTON, DC 20005 |
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