Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
01/25/1994
|
Application #:
|
07871586
|
Filing Dt:
|
04/20/1992
|
|
Inventor:
|
ALBERT N. HOPFER
|
|
Title:
|
THERMAL TRANSFER PLATE AND INTEGRATED CIRCUIT CHIP OR OTHER ELECTRICAL COMPONENT ASSEMBLIES INCLUDING SUCH PLATE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 865 PARKVIEW BOULEVARD |
| LOMBARD, ILLINOIS 60148 |
|
|
|
|
| LEYDIG, VOIT & MAYER, LTD. |
| JOHN M. AUGUSTYN |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| CHICAGO, IL 60601-6780 |
|
|
Search Results as of:
10/13/2025 01:48 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
