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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/29/1994
Application #:
07885965
Filing Dt:
05/20/1992
Inventors:
TOSHIO SHIOBARA, TAKAYUKI AOKI, KAZUTOSHI TOMIYOSHI, HISASHI SHIMIZU, TAKASHI TSUCHIYA
Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICES ENCAPSULATED THEREWITH
Assignment: 1
Reel/Frame:
006181/0694Recorded: 07/09/1992Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
06/22/1992
Exec Dt:
06/22/1992
Exec Dt:
06/22/1992
Exec Dt:
06/22/1992
Exec Dt:
06/22/1992
Assignee:
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH
GERALD M. MURPHY, JR.
301 NORTH WASHINGTON STREET
P.O. BOX 747
FALLS CHURCH, VA 22040-0747

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