Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/03/1994
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Application #:
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07919949
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Filing Dt:
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07/27/1992
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Inventors:
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FRANK R. BRYANT, FUSEN E. CHEN
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Title:
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SEMICONDUCTOR BOND PAD STRUCTURE AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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1310 ELECTRONICS DR. |
CARROLLTON, TEXAS 75006 |
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LISA K. JORGENSON |
SGS-THOMSON MICROELECTRONICS, INC. |
1310 ELECTRONICS DR. |
CARROLLTON, TX 75006 |
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