Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/31/1994
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Application #:
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07736380
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Filing Dt:
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07/26/1991
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Inventors:
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ERIC P. DIBBLE, STEVEN L. HANAKOVIC, VOYA R. MARKOVICH, DANIEL S. NIEDRICH et al
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Title:
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APPLYING SOLDER TO HIGH DENSITY SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| A CORPORATION OF NEW YORK |
| ARMONK, NEW YORK 10504 |
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| JUDITH D. OLSEN |
| IBM CORP. |
| DEPT. N50, BLDG. 251-2 |
| 1701 NORTH ST. |
| ENDICOTT, NY 13760 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| A CORPORATION OF NY |
| ARMONK, NEW YORK 10504 |
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| JUDITH D. OLSEN |
| IBM CORP. |
| DEPT. N50, BLDG. 251-2 |
| 1701 NORTH ST. |
| ENDICOTT, NY 13760 |
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