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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/31/1994
Application #:
07906971
Filing Dt:
06/30/1992
Inventor:
JOHN B. GILLETT
Title:
HIGH DENSITY INTERCONNECTION ASSEMBLY
Assignment: 1
Reel/Frame:
006178/0864Recorded: 06/30/1992Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
06/30/1992
Assignee:
A CORP. OF NY
ARMONK, NEW YORK 10504
Correspondent:
R. L. TROIKE
IBM CORP.
INTELLECTUAL PROP., 31BA/058
NEIGHBORHOOD RD.
KINGSTON, NY 12401

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