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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
5358032
Issue Dt:
10/25/1994
Application #:
08013423
Filing Dt:
02/04/1993
Inventors:
MASATSUGU ARAI, AKIOMI KOHNO, TOSHIO HATADA, YOSHIHIRO KONDO, TOSHIHIRO KOMATSU et al
Title:
LSI PACKAGE COOLING HEAT SINK, METHOD OF MANUFACTURING THE SAME AND LSI PACKAGE TO WHICH THE HEAT SINK IS MOUNTED
Assignment: 1
Reel/Frame:
006458/0506Recorded: 02/04/1993Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
ARAI, MASATSUGU
Exec Dt:
01/28/1993
KOHNO, AKIOMI
Exec Dt:
01/28/1993
HATADA, TOSHIO
Exec Dt:
01/28/1993
KONDO, YOSHIHIRO
Exec Dt:
01/28/1993
KOMATSU, TOSHIHIRO
Exec Dt:
01/28/1993
OTSUKA, KANJI
Exec Dt:
01/28/1993
SHIRAI, YUJI
Exec Dt:
01/28/1993
IWAI, SUSUMU
Exec Dt:
01/28/1993
Assignee:
HITACHI, LTD.
6 KANDA SURUGADAI, 4-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
STANLEY A. WAL
ANTONELLI, TERRY, STOUT & KRAUS
1919 PENNSYLVANIA AVENUE, N.W.
SUITE 600
WASHINGTON, D.C. 20006
Assignment: 2
Reel/Frame:
026109/0528Recorded: 03/25/2011Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HITACHI, LTD.
Exec Dt:
03/07/2011
Assignee:
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU
KAWASAKI-SHI
KANAGAWA, JAPAN 211-8668
Correspondent:
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 N. 17TH STREET, SUITE 1800
ARLINGTON, VIRGINIA 22209

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