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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/28/1995
Application #:
08046299
Filing Dt:
04/15/1993
Inventors:
HERBERT S. COLE, THERESA A. SITNIK-NIETERS, BERNARD GOROWITZ
Title:
PROCESS FOR HIGH DENSITY INTERCONNECTION OF SUBSTRATES AND INTERGRATED CIRCUIT CHIPS CONTAINING SENSITIVE STRUCTURES
Assignment: 1
Reel/Frame:
006523/0305Recorded: 04/15/1993Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
04/08/1993
Exec Dt:
04/08/1993
Exec Dt:
04/08/1993
Assignee:
ONE RIVER ROAD
SCHENECTADY, NEW YORK 12345
Correspondent:
GENERAL ELECTRIC COMPANY, MARVIN SNYDER
CRD PATENT DOCKET RM. 4A59
BLDG. K-1, SALAMONE
POST OFFICE BOX 8 - RIVER ROAD
SCHENECTADY, NY 12301
Assignment: 2
Reel/Frame:
007213/0263Recorded: 11/17/1994Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/31/1994
Assignee:
ATTN: GAY CHIN
6801 ROCKLEDGE DRIVE
BETHESDA, MARYLAND 20817
Correspondent:
MARTIN MARIETTA CORPORATION
GAY CHIN
6801 ROCKLEDGE DRIVE
BETHESDA, MARYLAND 20817

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