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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/04/1995
Application #:
08258949
Filing Dt:
06/13/1994
Inventors:
HENG S. HUANG, WOOD WU, KUN-LUH CHEN
Title:
PROCESS FOR PRODUCING HIGH DENSITY CONDUCTIVE LINES
Assignment: 1
Reel/Frame:
007056/0224Recorded: 06/13/1994Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/27/1994
Exec Dt:
05/27/1994
Exec Dt:
05/27/1994
Assignee:
NO. 13 INNOVATION RD. I
SCIENCE BASED INDUSTRIAL PARK
HSINCHU, TAIWAN
Correspondent:
GEORGE O. SAILE
20 MCINTOSH DRIVE
POUGHKEEPSIE, NY 12603

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