Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/11/1995
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Application #:
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08239380
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Filing Dt:
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05/06/1994
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Inventors:
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SHYH-MING CHANG, CHIH-CHIANG CHU, YU-CHI LEE
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Title:
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COMPOSITE BUMP FLIP CHIP BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 195 SEC. 4, CHUNG HSING RD. |
| CHUTUNG, HSINCHU, TAIWAN R.O.C. |
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| GEORGE O. SAILE |
| 20 MCINTOSH DR. |
| POUGHKEEPSIE, NY 12603 |
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