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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/22/1995
Application #:
08260571
Filing Dt:
06/16/1994
Inventors:
CHI J. SONG, GI B. CHA
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
007091/0289Recorded: 08/04/1994Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/10/1994
Exec Dt:
06/10/1994
Assignee:
50, HYANGJUNG-DONG, CHEONGJU
CHOONGCHUNGBOOK-DO, KOREA, REPUBLIC OF
Correspondent:
GENE Z. RUBINSON
LOWE, PRICE, LEBLANC ET AL.
99 CANAL CENTER PLAZA, SUITE 300
ALEXANDRIA, VA 22314

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