Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/29/1995
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Application #:
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08022027
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Filing Dt:
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02/24/1993
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Inventors:
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HIDEKAZU TAKANO, TOKIO YOSHIMITSU, AKINORI HIBINO, YOSHIHIDE SAWA, MOTOYUKI TOKI, YANG WU et al
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Title:
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METHOD OF FABRICATING AN INTERNAL COMPOSITE LAYER COMPOSED OF AN ELECTRICALLY INSULATING SUBSTRATE WITH A COPPER LAYER FORMED THEREON AND A FILM OF A COUPLING AGENT COVERING THE COPPER LAYER FOR A MULTILAYER CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1048 OAZA-KADOMA |
KADOMA-SHI, OSAKA, JAPAN |
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ALBERT TOCKMAN |
ARMSTRONG, WESTERMAN, HATTORI, MCLELAND |
& NAUGHTON |
SUITE 1000, 1725 K STREET, N.W. |
WASHINGTON, DC 20006 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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1048, OAZA-KADOMA |
KADOMA-SHI, OSAKA, JAPAN 571-8686 |
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KENJI KAMATA |
PANASONIC PATENT CENTER |
1130 CONNECTICUT AVE., N.W. SUITE 1100 |
WASHINGTON, DC 20036 |
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