Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/1995
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Application #:
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08194343
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Filing Dt:
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02/08/1994
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Inventors:
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AKIRA TAKASHIMA, TOSHIYUKI HONDA, MASAKI WAKI
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Title:
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METHOD OF FABRICATING A SEMICONDUCTOR DEVICE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1015, KAMIKODANAKA, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211, JAPAN |
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| 5950, SOEDA, IRIKI-CHO, SATSUMA-GUN |
| KAGOSHIMA, 895-14, JAPAN |
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| H.J. STAAS |
| STAAS & HALSEY |
| 1825 K STREET, N.W., SUITE 816 |
| WASHINGTON, D.C. 20006 |
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