Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/03/1995
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Application #:
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08054899
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Filing Dt:
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04/29/1993
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Inventors:
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SOLOMON I. BEILIN, MICHAEL G. PETERS, MICHAEL G. LEE, WEN-CHOU V. WANG
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Title:
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THROUGH HOLE INTERCONNECT SUBSTRATE FABRICATION PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3811 ZANKER RD |
| SAN JOSE, CALIFORNIA 95134-1402 |
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| CHRISTIE, PARKER & HALE |
| ATTN: RICHARD D. SEIBEL |
| P.O. BOX 7068 |
| PASADENA, CA 91109-7068 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1015, KAMIKODAMAKA, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211, JAPAN |
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| CHRISTIE, PARKER & HALE |
| RICHARD D. SEIBEL |
| P.O. BOX 7068 |
| PASADENA, CALIFORNIA 91109-7068 |
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