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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/19/1995
Application #:
08312672
Filing Dt:
09/28/1994
Inventors:
KEIJI KAYABA, YASUSHI SAWAMURA, MASAYUKI TANAKA
Title:
SEMICONDUCTOR DEVICE-ENCAPSULATING EPOXY RESIN COMPOSITION CONTAINING SECONDARY AMINO FUNCTIONAL COUPLING AGENTS
Assignment: 1
Reel/Frame:
015653/0923Recorded: 08/06/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/14/2004
Assignee:
5-8, HIGASHISHINAGAWA 2-CHOME
SHINAGAWA-KU
TOKYO, JAPAN 140-0002
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
ANDREW D. MEIKLE
P.O. BOX 747
FALLS CHURCH, VA 22040-0747

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