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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/30/1996
Application #:
08162265
Filing Dt:
12/07/1993
Inventors:
KAZUO SATO, MITSUHIRO SHIKIDA, SHIGEO OHASHI, TOSHIO HATADA, NORIYUKI ASHIWAKE et al
Title:
A COOLING DEVICE FOR SEMICONDUCTOR PACKAGES, HAVING FLEXIBLE FILM HEAT EXPULSION MEANS
Assignment: 1
Reel/Frame:
006795/0904Recorded: 12/07/1993Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/29/1993
Exec Dt:
11/29/1993
Exec Dt:
11/29/1993
Exec Dt:
11/29/1993
Exec Dt:
11/29/1993
Exec Dt:
11/29/1993
Exec Dt:
11/29/1993
Exec Dt:
11/29/1993
Assignee:
6, KANDA SURUGADAI 4-CHOME,
CHIYODA-KU, TOKYO, JAPAN
Correspondent:
ANTONELLI, TERRY, STOUT & KRAUS
MELVIN KRAUS
1919 PENNSYLVANIA AVENUE, N.W., STE. 600
WASHINGTON, D.C. 20006

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