Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/1996
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Application #:
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08260322
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Filing Dt:
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06/15/1994
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Inventor:
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YUKIHARU TAKEUCHI
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Title:
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LEAD FRAME AND RESIN-MOLDED-TYPE SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 711, AZA SHARIDEN, OAZA KURITA |
| NAGANO-SHI, NAGANO 380, JAPAN |
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| H. J. STAAS |
| STAAS & HALSEY |
| 1825 K STREET, N.W. |
| SUITE 816 |
| WASHINGTON, D.C. 20006 |
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