Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/18/1996
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Application #:
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08267878
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Filing Dt:
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06/28/1994
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Inventors:
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SURESH V. GOLWALKAR, RICHARD FOEHRINGER, MICHAEL WENTLING, RYO TAKATSUKI et al
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Title:
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MANUFACTURING DUAL SIDED WIRE BONDED INTEGRATED CIRCUIT CHIP PACKAGES USING OFFSET WIRE BONDS AND SUPPORT BLOCK CAVITIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 94086 |
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2-10-1 KOMINE, YAHATANISHI-KU |
KITAKYSUSHU, JAPAN 806 |
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BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN |
ATTN: LESTER J. VINCENT |
1279 OAKMEAD PARKWAY |
SUNNYVALE, CA 94086 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95052 |
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2-10-1 KOMINE YAHATANISHI-KU |
KITAKYSUSHU, JAPAN 806 |
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BALKELY, SOKOLOFF, TAYLOR & ZAFMAN |
LESTER J. VINCENT |
1279 OAKMEAD PARKWAY |
SUNNYVALE, CALIFORNIA 94086 |
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