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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
07/23/1996
Application #:
08280618
Filing Dt:
07/26/1994
Inventor:
YOSHIKAZU TAKAHASHI
Title:
PRESSURE CONTACT SEMICONDUCTOR DEVICE IN A FLAT PACKAGE
Assignment: 1
Reel/Frame:
007153/0853Recorded: 09/29/1994Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/19/1994
Assignee:
1-1, TANABESHINDEN KAWASAKI-KU, KAWASAKI CITY KANAGAWA, JAPAN
Correspondent:
BRUMBAUGH, GRAVES, DONOHUE & RAYMOND
RONALD B. HILDRETH
30 ROCKEFELLER PLAZA
NEW YORK, NY 10112
Assignment: 2
Reel/Frame:
024252/0451Recorded: 04/20/2010Pages: 32
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/30/2009
Assignee:
11-2 OSAKI 1- CHOME, SHINAGAWA-KU
TOKYO, JAPAN 141-0032
Correspondent:
MARC A. ROSSI
20609 GORDON PARK SQ.
SUITE 150
ASHBURN, VA 20176
Assignment: 3
Reel/Frame:
026970/0872Recorded: 08/26/2011Pages: 28
Conveyance:
MERGER AND CHANGE OF NAME
Assignors:
Exec Dt:
04/01/2011
Exec Dt:
04/01/2011
Assignee:
1-1, TANABESHINDEN, KAWASAKI-KU
KAWASAKI-SHI, JAPAN
Correspondent:
ROSSI, KIMMS & MCDOWELL
20609 GORDON PARK SQUARE
SUITE 150
ASHBURN, VA 20147

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