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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	5544017	Issue Dt:	08/06/1996	Application #:	08277163	Filing Dt:	07/19/1994
Inventors:	SOLOMON I. BEILIN, WILLIAM T. CHOU, DAVID KUDZUMA, MICHAEL G. LEE, TERUO MURASE et al
Title:	MULTICHIP MODULE SUBSTRATE

Assignment: 1

Reel/Frame:

007150/0560

Recorded: 09/26/1994

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

BEILIN, SOLOMON I.

Exec Dt:

07/15/1994

KUDZUMA, DAVID

Exec Dt:

07/15/1994

MURASE, TEROU

Exec Dt:

07/15/1994

ROMAN, JAMES J.

Exec Dt:

07/15/1994

WANG, WEN-CHOU VINCENT

Exec Dt:

07/15/1994

CHOU, WILLIAM T.

Exec Dt:

07/15/1994

LEE, MICHAEL G.

Exec Dt:

07/15/1994

PETERS, MICHAEL G.

Exec Dt:

07/15/1994

SWAMY SOM S.

Exec Dt:

07/15/1994

Assignee:

FUJITSU LIMITED

1015, KAMIKODANAKA, NAKAHARA-KU

KAWASAKI-SHI, KANAGAWA 211, JAPAN

Correspondent:

MCCUBBREY, BARTELS & WARD

DAVID SCHNAPF

ONE POST STREET, STE. 2700

SAN FRANCISCO, CA 94104-5231

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