Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/29/1996
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Application #:
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08406726
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Filing Dt:
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03/20/1995
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Inventors:
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SATYA CHILLARA, SHAHRAM MOSTAFAZADEH
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Title:
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HIGH DENSITY INTEGRATED CIRCUIT ASSEMBLY COMBINING LEADFRAME LEADS WITH CONDUCTIVE TRACES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95052 |
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HICKMAN & BEYER |
STEVE D. BEYER |
P.O. BOX 61059 |
PALO ALTO, CA. 94306 |
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