Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/05/1996
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Application #:
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08259615
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Filing Dt:
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06/14/1994
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Inventors:
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KUO K. WANG, SHAU-POH WANG
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Title:
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METHOD FOR SIMULATING MOLD FILLING OF SEMI-SOLID MATERIALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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20 THORNWOOD DRIVE, SUITE 220 |
ITHACA, NEW YORK 14850 |
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MICHAEL F. BROWN |
BARNARD, BROWN & MICHAELS |
306 E. STATE ST., SUITE 220 |
ITHACA, NY 14850 |
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