Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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12/03/1996
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Application #:
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08328734
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Filing Dt:
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10/25/1994
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Inventors:
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CHIEN-CHI CHAO, MING-HANE LIN, TED C. HO
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Title:
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PACKAGING ASSEMBLY WITH CONSOLIDATED COMMON VOLTAGE CONNECTIONS FOR INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 195 SECTION 4 CHANG-HSIG ROAD CHUTUNG |
| HSINCHU,, TAIWAN |
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| BO-IN LIN |
| 13445 MANDOLI DRIVE |
| LOS ALTO HILLS, CA 94022 |
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Assignment:
2
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ASSIGNMENT OF 50% INTEREST
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| 8F, 88, SEC 1, HSIN TAI WU RD |
| HSICHIH, TAIPEI, TAIWAN |
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| SANJEET K. DUTTA |
| 4 PARK PLAZA |
| SUITE 1600 |
| IRVINE, CA 92614 |
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Assignment:
3
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ASSIGNMENT OF 50% INTEREST
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| 8F, 88, SEC 1, HSIN TAI WU RD |
| HSICHIH, TAIPEI, TAIWAN |
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| SANJEET K. DUTTA |
| 4 PARK PLAZA |
| SUITE 1600 |
| IRVINE, CA 92614 |
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Assignment:
4
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ASSIGNMENT OF 50% INTEREST
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| 8F, 88, SEC 1, HSIN TAI WU RD |
| HSICHIH, TAIPEI, TAIWAN |
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| SANJEET K. DUTTA |
| 4 PARK PLAZA |
| SUITE 1600 |
| IRVINE, CA 92614 |
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