Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/17/1996
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Application #:
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08241110
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Filing Dt:
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05/11/1994
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Inventor:
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GEORGE S. KNOPF
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Title:
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SEMICONDUCTOR DIE PACKAGING TUB HAVING ANGULARLY OFFSET PAD-TO-PAD VIA STRUCTURE CONFIGURED TO ALLOW THREE-DIMENSIONAL STACKING AND ELECTRICAL INTERCONNECTIONS AMONG MULTIPLE IDENTICAL TUBS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1025 W. NASA BLVD. |
MELBOURNE, FLORIDA 32901 |
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CHARLES E. WANDS |
LAW OFFICES OF CHARLES E. WANDS |
5240 BABCOCK STREET, NE |
SUITE 306 |
PALM BAY, FL 32905 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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63 ROEBLING STREET |
#6B |
BROOKLYN, NEW YORK 11211 |
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EDMUND J. WALSH |
WOLF, GREENFIELD & SACKS, P.C. |
600 ATLANTIC AVENUE |
BOSTON, MA 02210 |
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