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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/28/1997
Application #:
08369838
Filing Dt:
01/06/1995
Inventors:
MICHAEL A. MIGNARDI, LAURINDA NG, RONALD S. CROFF, ROBERT MCKENNA, LAWRENCE D. DYER
Title:
SEPARATION OF WAFER INTO DIE WITH WAFER-LEVEL PROCESSING
Assignment: 1
Reel/Frame:
007302/0233Recorded: 01/06/1995Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/19/1994
Exec Dt:
12/19/1994
Exec Dt:
12/19/1994
Exec Dt:
12/19/1994
Exec Dt:
12/19/1994
Assignee:
LEGAL DEPARTMENT P.O. BOX 655474, M/S 219
13500 NORTH CENTRAL EXPRESSWAY
DALLAS, TEXAS 75265
Correspondent:
JULIE L. REED
TEXAS INSTRUMENTS INCORPORATED
LEGAL DEPARTMENT, M/S 219
13500 NORTH CENTRAL EXPRESSWAY
DALLAS, TEXAS 75265

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