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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/25/1997
Application #:
08539770
Filing Dt:
10/05/1995
Inventor:
AKIRA YOSHIGAI
Title:
RESIN-MOLDED TYPE SEMICONDUCTOR DEVICE WITH TAPE CARRIER CONNECTION BETWEEN CHIP ELECTRODES AND INNER LEADS OF LEAD FRAME
Assignment: 1
Reel/Frame:
007720/0193Recorded: 10/05/1995Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/25/1995
Assignee:
7-1, SHIBA 5-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
NORMAN P. SOLOWAY
HAYES, SOLOWAY, HENNESSEY ET AL.
175 CANAL STREET
MANCHESTER, NH 03101

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