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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/01/1997
Application #:
08271133
Filing Dt:
07/06/1994
Inventors:
KAZUHIRO NODA, SHINJI NAKAMURA, HISAO HAYASHI
Title:
MULTILAYERED INTERCONNECTION SUBSTRATE HAVING A RESIN WALL FORMED ON SIDE SURFACES OF A CONTACT HOLE
Assignment: 1
Reel/Frame:
007166/0784Recorded: 10/12/1994Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/16/1994
Exec Dt:
09/06/1994
Exec Dt:
09/06/1994
Assignee:
7-35 KITASHINAGAWA
6-CHOME, SHINAGAWA-KU
TOKYO, JAPAN
Correspondent:
HILL, STEADMAN & SIMPSON P.C.
P. PHILLIPS CONNOR
85TH FLOOR SEARS TOWER
233 S. WACKER DRIVE
CHICAGO, IL 60606

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