Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/29/1997
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Application #:
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08490776
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Filing Dt:
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06/15/1995
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Inventor:
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HEM P. TAKIAR
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Title:
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MULTICHIP INTEGRATED CIRCUIT MODULE WITH CROSSED BONDING WIRES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA |
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HICKMAN & BEYER |
STEVE D. BEYER |
P.O. BOX 61059 |
PALO ALTO, CA 94306 |
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