Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/24/1997
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Application #:
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08548019
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Filing Dt:
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10/25/1995
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Inventor:
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SURJIT S. CHADHA
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Title:
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A METHOD FOR PARTICULATE - FREE ENERGY BEAM CUTTING OF A WAFER OF DIE ASSEMBLIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY - P.O. BOX 6 |
| BOISE, IDAHO 83707 |
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| SEED AND BERRY |
| PAUL T. PARKER |
| 6300 COLUMBIA CENTER |
| 701 FIFTH AVENUE |
| SEATTLE, WASHINGTON 98104-7092 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PO BOX 6 |
| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83707 |
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| SEED AND BERRY LLP |
| PAUL T. PARKER |
| 6300 COLUMBIA CENTER |
| 701 FIFTH AVENUE |
| SEATTLE, WA 98104-7092 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| POST OFFICE BOX 6 |
| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83707 |
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| SEED AND BERRY LLP |
| EDWARD W. BULCHIS, ESQ. |
| 6300 COLUMBIA CENTER |
| 701 FIFTH AVENUE |
| SEATTLE, WA 98104-7092 |
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