Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/08/1997
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Application #:
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08516560
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Filing Dt:
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08/18/1995
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Inventor:
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MASATOSHI OMOTO
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Title:
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BONDING METHOD FOR CHIP-TYPE ELECTRONIC PARTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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22-22 NAGAIKE-CHO ABENO-KU |
OSAKA, JAPAN 545 |
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LARRY S. NIXON |
NIXON & VANDERHYE P.C. |
1100 NORTH GLEBE ROAD |
8TH FLOOR |
ARLINGTON, VA 22201 |
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