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Patent Assignment Abstract of Title
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Total Assignments: 4
Patent #:
Issue Dt:
09/02/1997
Application #:
08048991
Filing Dt:
04/16/1993
Inventor:
KEVIN G. DONOHOE
Title:
METHOD AND APPARATUS FOR IMPROVING ETCH UNIFORMITY IN REMOTE SOURCE PLASMA REACTORS WITH POWERED WAFER CHUCKS.
Assignment: 1
Reel/Frame:
006526/0526Recorded: 04/16/1993Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/16/1993
Assignee:
2805 E. COLUMBIA ROAD
BOISE, IDAHO 83706
Correspondent:
ANGUS C. FOX, III
MICRON SEMICONDUCTOR, INC.
2805 E. COLUMBIA ROAD
BOISE, ID 83706
Assignment: 2
Reel/Frame:
018826/0024Recorded: 01/30/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/16/1993
Assignee:
2805 EAST COLUMBIA ROAD
MAIL STOP 507, PATENT DEPARTMENT
BOISE, IDAHO 83706
Correspondent:
TERRIL G. LEWIS
20333 SH 249 SUITE 600
HOUSTON, TX 77070
Assignment: 3
Reel/Frame:
008592/0191Recorded: 04/23/1997Pages: 15
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/27/1994
Assignee:
8000 S. FEDERAL WAY
BOISE, IDAHO 83706
Correspondent:
MICRON TECHNOLOGY, INC.
WALTER D. FIELDS
8000 S. FEDERAL WAY
PATENT DEPT., MAIL STOP 525
BOISE, IDAHO 83706-9632
Assignment: 4
Reel/Frame:
018826/0045Recorded: 01/30/2007Pages: 10
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/27/1994
Assignee:
8000 S. FEDERAL WAY
BOISE, IDAHO 83706
Correspondent:
TERRIL G. LEWIS
20333 SH 249 SUITE 600
HOUSTON, TX 77070

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