Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/02/1997
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Application #:
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08496722
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Filing Dt:
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06/29/1995
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Inventors:
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CHARLES H. DENNISON, RANDHIR P. THAKUR
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Title:
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METHOD TO THERMALLY FORM HEMISPHERICAL GRAIN (HSG) SILICON TO ENHANCE CAPACITANCE FOR APPLICATION IN HIGH DENSITY DRAMS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MS #525 PATENT DEPT. |
| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83707 |
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| DAVID J. PAUL |
| MICRON TECHNOLOGY, INC. |
| 8000 S. FEDERAL WAY |
| MS #525 PATENT DEPT. |
| BOISE, ID 83707 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83706 |
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| MICRON TECHNOLOGY, INC. |
| DAVID J. PAUL |
| 8000 S. FEDERAL WAY |
| PATENT DEPT., MAIL STOP 525 |
| BOISE, ID 83706-9632 |
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