Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/02/1997
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Application #:
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08276511
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Filing Dt:
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07/14/1994
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Inventor:
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FERNANDO GONZALEZ
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Title:
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COMBINING TRENCH AND FIELD ISOLATION STRUCTURE FOR SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAIL STOP 507 |
| PATENT DEPARTMENT 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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| HAWLEY TROXELL ENNIS & HAWLEY |
| STEVEN R. ORMISTON |
| FIRST INTERSTATE CENTER |
| 877 MAIN STREET, SUITE 1000 |
| BOISE, ID 83702 |
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Assignment:
2
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RE-RECORD TO CORRECT THE ASSIGNMENT PREVIOUSLY RECORDED AT REEL 7068 FRAME 680.
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| MAIL STOP 507 PATENT DEPARTMENT |
| 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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| HAWLEY TROXELL ENNIS & HAWLEY |
| STEVEN R. ORMISTON |
| FIRST INTERSTATE CENTER |
| 877 MAIN STREET, SUITE 1000 |
| BOISE, IDAHO 83702 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAIL STOP 507 PATENT DEPARTMENT |
| 2805 E. COLUMBIA ROAD BOISE, ID 83706 |
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| STEVEN R. ORMISTON |
| 350 N. 9TH STREET |
| P.O. BOX 2894 |
| BOISE, ID 83701 |
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