Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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12/30/1997
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Application #:
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08559189
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Filing Dt:
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11/13/1995
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Inventors:
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EDWIN CHU, HU-KONG LAI
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Title:
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OUTPUT MAPPING OF DIE PAD BONDS IN A BALL GRID ARRAY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2500 AUGUSTINE DRIVE |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCHNECK & MCHUGH |
| THOMAS SCHNECK |
| P.O. BOX 2-E |
| SAN JOSE, CA 95109-0005 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2500 AUGUSTINE DRIVE |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCHNECK & MCHUGH |
| THOMAS SCHNECK |
| P.O. BOX 2-E |
| SAN JOSE, CA 95109-0005 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2398 WALSH AVENUE |
| SANTA CLARA, CALIFORNIA 95051 |
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| LAW OFFICES OF THOMAS SCHNECK |
| THOMAS SCHNECK |
| P.O. BOX 2-E |
| SAN JOSE, CA 95109-0005 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10F-2, 77 NAKING EAST RD., SEC. 4 |
| TAIPEI, TAIWAN R.O.C. 105 |
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| LAW OFFICES OF THOMAS SCHNECK |
| THOMAS SCHNECK |
| P.O. BOX 2-E |
| SAN JOSE, CA 95109-0005 |
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