Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/03/1998
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Application #:
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08684714
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Filing Dt:
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07/22/1996
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Inventor:
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LAI-JUH CHEN
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Title:
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METHOD AND APPARATUS FOR FORMING VERY SMALL SCALE CU INTERCONNECT METALLURGY ON SEMICONDUCTOR SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 195 SEC. 4, CHUNG HSING RD |
| CHUTUNG, HSINCHU, TAIWAN 31015 |
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| GEORGE O. SAILE |
| 20 MCINTOSH DRIVE |
| POUGHKEEPSIE, NY 12603 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 201, 2F, 205 DUNHUA NORTH ROAD |
| TAIPEI, TAIWAN 105 |
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| TRANSPACIFIC IP II LTD. |
| ROOM 201, 2ND FLOOR, NO. 205 |
| DUNHUA NORTH ROAD |
| TAIPEI, 105 TAIWAN |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO.201, DUNHUA NORTH ROAD, SONGSHAN DISTRICT |
| 9F |
| TAIPEI CITY, TAIWAN 105 |
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| MEYERTONS, HOOD, KIVLIN, KOWERT & GOETZE |
| 1120 SOUTH CAPITAL OF TEXAS HIGHWAY |
| BUILDING 2, SUITE 300 |
| AUSTIN, TX 78746 |
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