Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/21/1998
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Application #:
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07943908
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Filing Dt:
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09/11/1992
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Inventor:
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HEE G. LEE
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Title:
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LEAD ON CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 50 HYANGJEONG-DONG, CHEONGJU-SI, CHUNGCHEONGBUK-DO KOREA |
| CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF |
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| BERNARD R. GANS |
| POMS, SMITH, LANDE & ROSE |
| 2121 AVENUE OF THE STARS, SUITE 1400 |
| LOS ANGELES, CA 90067 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1, HYANGJEONG-DONG, HEUNGDUK-KU, CHEONGJU-SI |
| CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF |
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| MORGAN, LEWIS & BOCKIUS LLP |
| ROBERT J. GAYBRICK |
| 1800 M STREET, N.W. |
| WASINGTON, D.C. 20036 |
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