Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/30/1998
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Application #:
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08582643
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Filing Dt:
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01/04/1996
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Inventors:
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THIAM B. LIM, SARVOTHAM M. BHANDARKAR
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Title:
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IC PACKAGING LEAD FRAME FOR REDUCING CHIP STRESS AND DEFORMATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NATIONAL UNIVERSITY OF SINGAPORE |
| 11 SCIENCE PARK RD., SCIENCE PARK II |
| SINGAPORE, SINGAPORE 0511 |
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| MELTZER, LIPPE, GOLDSTEIN, ET AL. |
| 190 WILLIS AVENUE |
| MINEOLA, NY 11501 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SINGAPORE SCIENCE PARK II |
| 11 SCIENCE PARK ROAD |
| SINGAPORE, SINGAPORE 11768 |
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| PROSKAUER ROSE LLP |
| GREGG I. GOLDMAN |
| 1585 BROADWAY |
| NEW YORK, NY 10036-8299 |
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