Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/1998
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Application #:
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08673278
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Filing Dt:
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06/28/1996
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Inventors:
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DO S. JEONG, HAI J. SOHN, HYEON J. JEONG
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Title:
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LEAD FRAMES INCLUDING EXTENDED TIE-BARS, AND SEMICONDUCTOR CHIP PACKAGES AND FABRICATION METHODS USING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416 MAETAN-DONG, PALDAL-GU |
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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BELL, SELTZER, PARK & GIBSON, P.A. |
MITCHELL S. BIGEL |
P.O. BOX 34009 |
1211 EAST MOREHEAD STREET |
CHARLOTTE, NE 28234 |
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