Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/17/1998
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Application #:
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08733154
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Filing Dt:
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10/17/1996
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Inventors:
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DENNIS F. CLOCHER, GLENN G. DAVES, PETER M. ELENIUS, JOSEPH J. LISOWSKI et al
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Title:
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HIGH PERFORMANCE, LOW COST MULTI-CHIP MODULE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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OLD ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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IBM CORPORATION |
STEVEN J. SOUCAR |
INTELLECTUAL PROPERTY LAW DEPT. |
1580 ROUTE 50, DEPT. 18G/BLDG. 300-482 |
HOPEWELL JUNCTION, NY 12533-6531 |
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