Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/19/1999
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Application #:
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08785695
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Filing Dt:
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01/17/1997
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Inventor:
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GI B. CHA
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Title:
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SEMICONDUCTOR PACKAGE
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Assignment:
1
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 1600 |
| ROCHESTER, NEW YORK 14692 |
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| THOMPSON, HINE AND FLORY |
| BRADLEY A. KELLER |
| 2000 COURTHOUSE PLAZA N.E. |
| P.O. BOX 8801 |
| DAYTON, OHIO 45401 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU |
| CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF 360-4 |
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| FLESHNER & KIM |
| DANIEL Y.J. KIM |
| 8229 BOONE BLVD. |
| SUITE 840 |
| VIENNA, VA 22182 |
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