Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/16/1999
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Application #:
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08690405
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Filing Dt:
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07/25/1996
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Inventor:
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LAI-JUH CHEN
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Title:
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METHOD OF PLANARIZING WAFERS WITH SHALLOW TRENCH ISOLATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHUTUNG |
| 195 SEC. 4, CHUNG HSING RD. |
| HSINCHU, TAIWAN R.O.C |
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| GEORGE O. SAILE |
| 20 MCINTOSH DR. |
| POUGHKEEPSIE, NY 12603 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 1402, 14F, NO. 205, DUNHUA N. ROAD, SONGSHAN DISTRICT |
| TAIPEI CITY, TAIWAN |
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| WPAT. P.C. |
| 1940 DUKE ST., SUITE 200 |
| ALEXANDRIA, VA 22314 |
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