Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/16/1999
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Application #:
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08819261
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Filing Dt:
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03/18/1997
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Inventor:
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TAKEHIRO SAITOH
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Title:
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SEMICONDUCTOR DEVICE MOLDED IN PLASTIC PACKAGE FREE FROM CRACK BY VIRTUE OF ORGANIC STRESS RELAXATION LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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7-1, SHIBA 5-CHOME, MINATO-KU |
TOKYO, JAPAN |
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HELFGOTT & KARAS, P.C. |
SAMSON HELFGOTT |
EMPIRE STATE BUILDING, 60TH FLOOR |
350 5TH AVENUE |
NEW YORK, NEW YORK 10118 |
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