Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/06/1999
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Application #:
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08687723
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Filing Dt:
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07/26/1996
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Inventors:
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MICHAEL G. LEE, SOLOMON I. BEILIN, WILLIAM T. CHOU, MICHAEL G. PETERS, WEN-CHOU V. WANG
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Title:
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METHODS OF ETCHING THROUGH WAFERS AND SUBSTRATES WITH A COMPOSITE ETCH STOP LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NAKAHARA-KU, KAWASAKI-SHI |
| 1-1, KAMIKODANAKA, 4-CHOME |
| KANAGAWA 211, JAPAN |
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| COUDERT BROTHERS |
| 4 EMBARCADERO CENTER, SUITE 3300 |
| SAN FRANCISCO, CA 94111 |
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