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Patent Assignment Abstract of Title
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Total Assignments: 6
Patent #:
5905301
Issue Dt:
05/18/1999
Application #:
08792394
Filing Dt:
02/03/1997
Inventors:
SEIJI ICHIKAWA, TOMOAKI HIROKAWA, TOMOAKI KIMURA, JUNICHI TANAKA, TAKU SATO et al
Title:
MOLD PACKAGE FOR SEALING A CHIP
Assignment: 1
Reel/Frame:
008432/0982Recorded: 02/03/1997Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ICHIKAWA, SEIJI
Exec Dt:
01/14/1997
HIROKAWA, TOMOAKI
Exec Dt:
01/14/1997
KUMURA, TOMOAKI
Exec Dt:
01/14/1997
TANAKA, JUNICHI
Exec Dt:
01/14/1997
SATO, TAKU
Exec Dt:
01/14/1997
MURATA, SATOSHI
Exec Dt:
01/14/1997
KUBOTA, TSUTOMU
Exec Dt:
01/14/1997
OGIHARA, TAKEO
Exec Dt:
01/14/1997
UCHIDA, KENJI
Exec Dt:
01/14/1997
Assignee:
NEC CORPORATION
7-1, SHIBA 5-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
SUGHRUE, MION, ZINN,MACPEAK & SEAS
J. FRANK OSHA
2100 PENNSYLVANIA AVE., N.W.
SUITE 800
WASHINGTON, DC 20037-3202
Assignment: 2
Reel/Frame:
008645/0467Recorded: 08/08/1997Pages: 4
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL 8432, FRAME 0982.
Assignors:
ICHIKAWA, SEIJI
Exec Dt:
01/14/1997
HIROKAWA, TOMOAKI
Exec Dt:
01/14/1997
KIMURA, TOMOAKI
Exec Dt:
01/14/1997
TANAKA, JUNICHI
Exec Dt:
01/14/1997
SATO, TAKU
Exec Dt:
01/14/1997
MURATA, SATOSHI
Exec Dt:
01/14/1997
KUBOTA, TSUTOMU
Exec Dt:
01/14/1997
OGIHARA, TAKEO
Exec Dt:
01/14/1997
UCHIDA, KENJI
Exec Dt:
01/14/1997
Assignee:
NEC CORPORATION
7-1, SHIBA 5-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
SUGHRUE, MION, ZINN, MACPEAK & SEAS,
PLLC, J. FRANK OSHA
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, D.C. 20037-3202
Assignment: 3
Reel/Frame:
011658/0956Recorded: 03/30/2001Pages: 24
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
MICRON ELECTRONICS, INC.
Exec Dt:
03/22/2001
Assignee:
MEI CALIFORNIA, INC.
1545 BARBER LANE
MILPITAS, CALIFORNIA 95035
Correspondent:
MICRON ELECTRONICS, INC.
STEVEN P. ARNOLD
900 EAST KARCHER ROAD
NAMPA, ID 83687
Assignment: 4
Reel/Frame:
012530/0708Recorded: 02/01/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
NEC CORPORATION
Exec Dt:
01/25/2002
Assignee:
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
1753, SHIMONUMABE, NAKAHARA-KU
KAWASAKI-KANAGAWA 211-8666, JAPAN
Correspondent:
SUGHRUE MION, PLLC
J. FRANK OSHA
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, D.C. 20037-3213
Assignment: 5
Reel/Frame:
017422/0528Recorded: 04/04/2006Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Exec Dt:
03/15/2006
Assignee:
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI
KANAGAWA, JAPAN 211-8668
Correspondent:
HOWARD L. BERNSTEIN
2100 PENNSYLVANIA AVENUE, SUITE 800
WASHINGTON, D.C. 20037
Assignment: 6
Reel/Frame:
025173/0161Recorded: 10/21/2010Pages: 9
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
NEC ELECTRONICS CORPORATION
Exec Dt:
04/01/2010
Assignee:
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,
KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037

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