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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/25/1999
Application #:
08774609
Filing Dt:
12/30/1996
Inventor:
DAVID J. CORISIS
Title:
LEADS UNDER CHIP IN CONVENTIONAL IC PACKAGE
Assignment: 1
Reel/Frame:
008377/0627Recorded: 12/30/1996Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/19/1996
Assignee:
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
TRASK, BRITT & ROSSA
JAMES R. DUZAN
P.O. BOX 2550
SALT LAKE CITY, UT 84110
Assignment: 2
Reel/Frame:
025378/0715Recorded: 11/16/2010Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/26/2008
Assignee:
WALKER HOUSE, 87 MARY STREET
GEORGE TOWN, GRAND CAYMAN, CAYMAN ISLANDS KY1-9002
Correspondent:
DAVID C. KELLOGG
870 MARKET STREET
SUITE 984
SAN FRANCISCO, CA 94102

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