Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/29/1999
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Application #:
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08655166
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Filing Dt:
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05/30/1996
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Inventors:
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MASANORI MAYUZUMI, KATSUAKI YOSHIZAWA, YOSHINORI HAYAMIZU
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Title:
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ETCHING METHOD OF SILICON WAFER SURFACE AND ETCHING APPARATUS OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-2 MARUNOUCHI 1 CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| RONALD R. SNIDER |
| P.O. BOX 27613 |
| WASHINGTON, D.C. 20038-7613 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE, FILED ON 07-15-1996, RECORDED ON REEL 8081, FRAME 0132, ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST.
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| 4-2 MARUNOUCHI 1 CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| RONALD R. SNIDER |
| P.O. BOX 27613 |
| WASHINGTON, D.C. 20038-7613 |
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