Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/20/1999
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Application #:
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07758991
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Filing Dt:
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09/10/1991
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Inventors:
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FARID Y. AOUDE, LAWRENCE D. DAVID, RENUKA S. DIVAKARUNI, SHAJI FAROOQ, LESTER W. HERRON et al
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Title:
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COPPER-BASED PASTE CONTAINING COPPER ALUMINATE FOR MICROSTRUCTURAL AND SHRINKAGE CONTROL OF COPPER-FILLED VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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IRA DAVID BLECKER |
INTELLECTUAL PROPERTY LAW, IBM CORP. |
DEPT. 901, BLDG 300-482, ROUTE 52 |
HOPEWELL JUNCTION, NY 12533 |
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