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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/20/1999
Application #:
08889733
Filing Dt:
07/08/1997
Inventors:
JENN-GWO HWU, KUO-CHUNG LEE, HONG-YUAN CHANG
Title:
TEMPERATURE COMPENSATION METHOD FOR SEMICONDUCTOR WAFERS IN RAPID THERMAL PROCESSOR USING SEPARATED HEAT CONDUCTING RINGS AS SUSCEPTORS
Assignment: 1
Reel/Frame:
008686/0456Recorded: 07/08/1997Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/29/1997
Exec Dt:
05/29/1997
Exec Dt:
05/29/1997
Assignee:
18 FLOOR, NO. 106, SEC. 2, HO-PIN E. ROAD
TAIPEI, TAIWAN R.O.C
Correspondent:
BEVERIDGE, DEGRANDI, WEILACHER & YOUNG
JOSEPH A. DEGRANDI
1850 M STREET, N.W. (SUITE 800)
WASHINGTON, D.C. 20036

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